Raspberry Pi 4B - 98-Day Validation

Three Key Discoveries

40.3%
Performance increase
98 Days
Effect persistence
30%
Energy efficiency gain

Bottom line: RFO enables silicon to run faster, cooler, and more efficiently-with effects that last months without power.

I. Experimental Methodology & Timeline

After nearly two years of validating RFO effects on discrete semiconductors, we extended testing to a full computing platform. The Raspberry Pi 4B was chosen for its constrained thermal envelope and well-documented baseline performance.

Three-phase design:

All experiments used identical hardware, controlled ambient conditions, and standardized stress testing protocols to ensure reproducible results.

II. July 24, 2025 - Full Experimental Run

Protocol: 30 minutes focused SoC exposure + 90 minutes distributed component treatment + 10 minutes live field activation during stress test at 2.1 GHz.

317%
Max clock time increase
40.3%
Frequency improvement
30%
Thermal efficiency gain
34.6%
Throughput increase

Energy efficiency: computations per watt-second = 7.6 (control) vs 9.9 (RFO) → +30%.

Average frequency (MHz)
Time at 2.1 GHz (%)
Severe throttling (%)
Throttle delay (s)
Total work (MHz·s)
Thermal efficiency (MHz/°C)
Compute per watt-second

III. Persistence Discovery (98 Days)

The board retained a 33% performance improvement from a single 30-minute exposure 98 days prior, with no power or additional treatment in between-consistent with semi-permanent material changes.

IV. April 17, 2025 - Initial Validation at Stock Clock

61%
Throttling reduction
12.8%
Avg clock increase
68 s
Full-speed duration
RPi 4B - April 17 clock speed over time (MHz).
RPi 4B - April 17 temperature over time (°C).

V. Scientific Interpretation

VI. Closing

RFO reshapes the operating profile of silicon systems without firmware changes, heatsink mods, or continuous power. Performance becomes more stable. Efficiency improves. Effects last.